PCB ANALYSIS

SIGNAL INTEGRITY

Signal integrity (SI) analysis is an essential part of modern electronic design. Increasingly fast edge rates in today’s integrated circuits (ICs) cause detrimental high-speed effects, even in PCB designs running at low operating frequencies. As driver ICs switch faster, a growing volume of boards suffer from signal degradation, including over/undershoot, ringing, glitching, crosstalk, and timing problems. When degradation becomes serious enough, the logic on a board can fail. The emphasis is on getting designs right the first time, avoiding costly overdesign, and saving recurrent layout, prototype, and test cycles in the lab.

DDR3-1866 - USB 3.0 - SATA - PCIe - HDMI - LVDS

Eye Diagram

Voltage Drop

POWER INTEGRITY

The ever-increasing number of voltages being used by ICs, in addition to dramatic increases in power consumption, make proper power delivery an exceedingly difficult task. Compounding these issues are reduced layer counts, smaller noise margins, and increasing operating frequencies. With inadequate power delivery, designs exhibit signal integrity errors, which cause the logic on the board to fail. This will ultimately help you reduce prototype spins and get to market faster, while creating more reliable products.

VOLTAGE DROP - CURRENT DENSITY - DECOUPLING CAPACITOR

THERMAL ANALYSIS

Thermal design is a critical aspect of PCB design, taking place throughout the PCB design flow, from part selection through placement and routing to design verification. By considering thermal compliance throughout the entire design process, from placement to final routing, results in fewer design iterations. It also minimizes the number of physical prototypes required. In LED lighting applications, the heat flow path is crucial for good thermal performance of the luminaire. Therefore the PCB plays an important role and there are various PCB types that can be applied to improve thermal management. For example, a large amount of metal in or on the PCB is the key for effective heat spread.

Solid Temperature